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PI 88 SEM PicoIndenter

Bruker Hysitron

Bruker Hysitron PI 88

Advanced in-situ nanomechanical testing for SEM and FIB/SEM

The Hysitron PI 88 SEM PicoIndenter is a comprehensive in-situ nanomechanical testing system for SEM and FIB/SEM. An advanced instrument with powerful features for enhanced performance and flexibility. Capture video from your microscope in real-time, to correlate with your mechanical data.

  • Advanced XYZ sample positioning stage with a wide >8mm travel range
  • Performech digital controller with a78kHz feedback rate
  • Nanoindentation, compression, tension and bending test modes
  • Active vibration dampening with Hysitron’s proprietary Q-Control
  • Modular design – add testing modes in future as you need to

Contact us for more information and quotes:
+44 (0)1223 422 269 or info@blue-scientific.com

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Hysitron PI 88 SEM Picoindenter

Nanoscratch Testing

Applications

  • Nanoindentation with EBSD
  • Films & coatings
  • Temperature dependent mechanical properties
  • Ultra-hard materials & large structures

Benefits

  • Simultaneous testing & imaging
  • Advanced, high performance system
  • Ideal for SEM and FIB/SEM
  • Modular system; upgrade with a whole range of testing techniques

Testing Modes

Nanoindentation

Nanoindentation

  • Precise positioning
  • Nanoscale load and depth control
  • Determine fundamental mechanical properties eg hardness and elastic modulus
  • Suitable for a wide variety of materials

Tensile Testing

Tensile

  • Direct-Pull and Push-to-Pull (PTP) testing
  • Test dog-bone specimens, thin films and nanowires
  • Measure stress-strain behaviour in-situ
  • Study low dimensional materials not easily tested with traditional methods.

Bend Testing

Bending

  • Align loads and measure accurately with SEM imaging
  • Measure bending stiffness and fracture toughness
  • Single-phase, composite or layered materials.

Compression Testing

Compression

  • Compress pillars, particles and other small scale structures
  • Measure stress-strain behaviour and yield properties
  • Simultaneously observe deformation mechanisms in real time
  • Check tip alignment with SEM imaging

Optional Upgrade Modes

  • Heating up to 800°C
  • Electrical characterisation
  • Push-to-pull device
  • nanDynamic mode
  • nanoScratch mode

 

Modular Design

The PI 88 is modular so it can be upgraded with Hysitron’s full range of testing techniques as you need them in future, including:

  • 800°C heating
  • Scratch testing
  • 5-axis sample positioning
  • Electrical characterisation
  • Dynamic fatigue testing
  • Interchangeable extended range (500 mN, 150 µm) transducer

The PI 88 attaches to the SEM sample stage, and can be removed at any time.

Both 3-axis (X, Y, Z) and 5-axis (X, Y, Z, tilt, rotation) sample positioning stages are available:

Hysitron PI 88 Sample Stage

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