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PHI VersaProbe III Scanning XPS Microprobe

Physical Electronics Scanning XPS Microprobe

NEW VersaProbe III

Scanning XPS Microprobe

The VersaProbe III is the new scanning XPS microprobe from PHI. It is a multi-technique XPS instrument, optimised for flexibility. The latest in the VersaProbe line builds on PHI’s patented scanning microprobe technology and dual beam charge neutralisation, with 2-3 times higher sensitivity at all beam sizes compared to the previous model. Perform large area and micro-area XPS, chemical state imaging, sputter depth profiling and more.

New and Improved XPS Technology

  • 2-3 times higher sensitivity, with new analyser input lens
  • Faster elemental and chemical imaging
  • New angle dependent technology for +/- 5 degree solid angle collection for ADXPS measurements
  • Hot/cold stage for temperatures of -140° C to +600° C
  • Hot sample plate for experiments up to 800° C
  • 4-contact transferable sample mount for in-situ controlled potential experiments
  • Increased sensitivity and improved energy resolution
  • Improved Auger performance: higher energy resolution and better signal to noise

Contact us for more information and quotes:
01223 422 269 or info@blue-scientific.com

VersaProbe III Brochure Contact us

PHI VersaProbe III

Applications

  • Insulating samples
  • Inorganic thin films
  • Polymers
  • Chemical imaging
  • Battery analysis – more info

Benefits:

  • High performance large area and micro area spectroscopy
  • Turnkey, automated large area analysis
  • Multi-technique test chamber, with multiple photon and ion sources

About XPS

X-ray photoelectron spectroscopy (XPS/ESCA) is the most widely used method for surface analysis, with many well established industrial and research applications. XPS provides quantitative elemental and chemical state information about surfaces and thin film structures. The technique is used for a diverse range of materials applications, including: polymers, metals, catalysts, thin films, batteries, wear coatings, nanomaterials, semiconductor devices, magnetic storage media, display technology, biomedical devices and photovoltaic applications.

Versaprobe III Features

PHI VersaProbe Software

User-friendly software

  • Scanned, micro-focused, monochromatic X-ray beam
  • X-ray beam induced secondary electron imaging
  • Dual beam charge neutralisation
  • Large area XPS
  • Micro area XPS
  • Chemical state imaging with 128 data channels
  • Sputter depth profiling
  • Floating column argon ion gun
  • Compucentric Zalar rotation
  • Angle dependent XPS
  • Five axis automated sample manipulator
  • 25 mm and 60 mm diameter sample holders

Optional:

  • 10 kV C60 ion gun
  • 20 kV C60 ion gun
  • 20 kV Ar2500+ gas cluster ion gun
  • 100 nm Scanning AES
  • UV light source for UPS
  • Dual anode, achromatic x-ray source
  • Sample transfer vessel
  • Hot/cold sample manipulator
  • Custom sample preparation chambers

Automated XPS analysis

Fully automated XPS analysis

Large Area Spectroscopy

Fully automated analysis:

  • Point and click to define the analysis area
  • Robust Auto-Z sample alignment at all spot sizes
  • No-tune dual beam charge neutralisation
  • Move easily from insulator to conductor in auto analysis sequences

Large area XPS spectroscopy

60 mm diameter sample platen for automated XPS analysis.

 

 

Superior Micro Area Performance

  • Point and click to define the analysis area
  • Robust Auto-Z sample alignment
  • No-tune dual beam charge neutralisation
  • Move from insulator to conductor in auto analysis sequences

 

Micro area spectroscopy

Sputter Depth Profiling

  • Micro-focused X-ray beam
  • High sensitivity spectrometer
  • High performance floating column argon ion gun
  • Turn-key dual beam charge neutralisation
  • Compucentric Zalar Rotation™ to enhance layer definition
  • Micro-area sputter depth profiling
  • Multi-point sputter depth profiling

Inorganic Sputter Depth Profiling

  • High performance 0-5 keV Ar+ ion gun
  • Low voltage floating column for ultra thin film sputter depth profiling
  • Bend in ion column to stop neutrals

Inorganic sputter depth profiling

2 keV sputter depth profile of a multi-layer PVD TiC/C coating on silicon, using Zalar rotation to enhance layer definition.

Inorganic Sputter Depth Profiling

2 keV sputter depth profile of a multi-layer coating on a computer hard disk, using Zalar rotation to enhance layer definition.

Organic Sputter Depth Profiling

  • Optional 10 and 20 kV C60 ion guns
  • Optional 20 kV Ar2500+ gas cluster ion gun
    • Mass filtered cluster ion sources
    • Bend in ion column to stop neutrals

Organic Sputter Depth Profiling

10 kV C60+ sputter depth profile of 3 nm Irganox 3114 layers in an Irganox 3110 film.

Organic sputter depth profiling

20 kV Ar2500+ sputter depth profile of a 10 µm thick multi-layer polymer film showing composition and layer definition.

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